BGA (Ball Grid Array)

Package Description

The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high lead count (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced co-planarity problems and minimized handling issues.


AiPac’s plastic and metal BGA package family consists of package sizes from 23x23 mm to 35x35 mm - with custom designs up to 45x45 mm. The metal BGA is uses an inverted 'cavity-down' structure with a copper heatsink built into the substrate, cutting thermal resistance by half or more. We provide substrate design engineering services and procure substrate fabrication, as well as perform prototype and production assembly manufacturing.






Package Dimensions