We provide the following services:
- Substrate Design
- PCB Design
- Mechanical Design
- Test board/load board/fixture
Out Substrate and PCB Design Capabilities: The AiPac team has many years of experiences in designing a wide range of Substrate and printe circuit boards:
- Substrate for BGA, Redistribution layer, Chip On Board.
- PCB from a simple single layer thru-hole to complex multi-layer (over 50 layer high speed desgns), double-sided surface mount designs.
For our design, we will consider and focus the following design rules:
- Analog, Digital & Mixed Signal Designs
- Single/Double-sided & High Density
- Thru-hole & Surface Mount Technology
- Multi-layer and Split Planes
- Differential Pairs
- Matched Length Nets
- EMI Reduction
- Signal Integrity
- Proper Signal Return Paths
- Blind/Buried Vias
SPECIALIZE IN TEST DESIGN AND BUILD COMPLETE BOARD & FIXTURE: Burn-in/ Demo/ Evaluation/ Load/ Socket Boards/ Probe Cards
Mechanical Design: lead frame, box design, 3D modeling.