Engineering

We provide the following services:

  • Substrate Design
  • PCB Design
  • Mechanical Design
  • Test board/load board/fixture

Out Substrate and PCB Design Capabilities: The AiPac team has many years of experiences in designing a wide range of Substrate and printe circuit boards:

  • Substrate for BGA, Redistribution layer, Chip On Board.
  • PCB from a simple single layer thru-hole to complex multi-layer (over 50 layer high speed desgns), double-sided surface mount designs.

For our design, we will consider and focus the following design rules:

  • Analog, Digital & Mixed Signal Designs
  • Single/Double-sided & High Density
  • Thru-hole & Surface Mount Technology
  • Multi-layer and Split Planes
  • Microstrip/Stripline
  • Differential Pairs
  • Matched Length Nets
  • EMI Reduction 
  • Signal Integrity
  • Proper Signal Return Paths
  • Blind/Buried Vias

SPECIALIZE IN TEST DESIGN AND BUILD COMPLETE BOARD & FIXTURE: Burn-in/ Demo/ Evaluation/ Load/ Socket Boards/ Probe Cards

Mechanical Design: lead frame, box design, 3D modeling.