IC Assembly

AiPac has a broad line of IC packages including QFP, QFN, BGA and COB (Chip on Board) package technologies.

IC Assembly

  • Backgrind
  • Wafer Saw
  • Die Attach
  • Bonding
  • Molding
  • Marking
  • Trim and For

               

 

 

 

 

 

 

       Full Service Assembly: Wafers-In - Packaged Devices-Out